Dr. Nils F. Nissen is head of the department Environmental and Reliability Engineering at the Fraunhofer Institute for Reliability and Microintegration (IZM) in Berlin, Germany. The Environmental and Reliability Engineering department of this microelectronics institute is supporting technology development by integrating environmental and reliability aspects right from the start. This means dealing with all environmental facets of new electronic technologies, from eliminating toxic substances to improving the recycling of products, from screening the latest process technologies in electronics to the ecodesign and environmental assessment of products and systems. CO2 footprinting and climate neutrality are the most prevalent topics in this area currently. In total, Dr. Nissen has been working 27 years at the juncture of electronics technology and environmental issues, and he is the Technical Chair of the Electronics Goes Green conference series.

Petru Demian, Ph.D. in Electronic and Telecommunication (2004) from the Technical University Timisoara in the field of “Optimizing testing method for numeric electronic equipment”.
From 1992 to 2000 he was Assistant or Junior Lecturer at the Technical University Timisoara and taught Numeric Circuit, Microcontrollers and Industrial Testing courses and laboratories. In parallel with the University activities, he worked in SW development and SW testing projects for complex airplane units for Boing 777, for Rada/Timtech local company branch.
In the period 2000-2006, he managed SW development teams for international projects in Continental Company (operating systems for body control units and instrument clusters, complex application modules and SW tools).
In the period 2006-2018, he was managing the Industrial Engineering activities for the Continental Timisoara Plant that involved SW tools & database for production, production equipment, test equipment and process development.
Since 2018 he is managing the FM and Special project activities in Continental Plant that involve projects in sustainability end energy efficiency increase (CHP, common rail implementation, Green Plant label actions, WW Energy responsible inside the business unit), projects in FM (extension of actual factory, energy efficiency improvement) and EU Project ZDMP user cases implementations.
He is the Plant interface with more Universities from Timisoara (Electronic and Telecommunication, Automatic & Computer and Management & Transportation) and running together more projects in SW, Industry 4.0 energy efficiency and sustainability.

Attila Bonyár is an associate professor and head of the Nanotechnology laboratory at the Department of Electronics Technology, Faculty of Electronics Engineering and Informatics, Budapest University of Technology and Economics. He has two M.Sc. degrees in electrical engineering (2009) and biomedical engineering (2011), a Ph.D. (2014), and habilitation (2021) in electrical engineering. His current research activities are focused on the development of optical biosensor technologies utilizing plasmonics, low-dimensional nanomaterials, nanocomposites and nanometrology. He is the chair of the IEEE NTC/EPS Nanopackaging/Nanotechnology Technical Committee (since 2022, co-chair since 2020) and actively serves in many other international committees in elected positions. He is a Steering Committee member for two regional IEEE conferences (IEEE-SIITME, International Symposium for Design and Technology in Electronics Packaging, since 2014 and IEEE-ISSE, International Spring Seminar on Electronics Technology, since 2017). Since 2019 he is the chair of the IEEE Hungary&Romania EPS&NTC Joint Chapter. He also serves IEEE NTC as a regional chapter coordinator in R8.

Traian Cucu is presently leading the Engineering Department at Ametec Coining. He oversees all R&D and engineering activities, providing technical solutions and new materials to support the full solution offering for the packaging and assembly markets. He received his B.Sc degree from “Politehnica” University of Timisoara, , Faculty of Electrical and Power Engineering, Specialization: Industrial Power Systems and his Ph.D. from Politechnic University of Bucharest, Faculty of Electronics, Telecommunications and Information Technologies, Specialization: Electronic Technology. He was working with major OEMs on transition to finer pitch designs and 3D assembly systems for the next generation devices. From 2013, as Global Product Manager for Solder Paste, was in charge of the solder paste product development, overseeing the product development programs and directing Alpha’s global solder paste strategy, during a period of 4 years. During that period, he was directly involved in new solder paste chemistry platforms developments and new alloy developments. From 2017, as Global Applications and Technologies Experts Group Leader at MacDermid Alpha Electronics Solutions, he was overseeing the new applications and technologies development programs for the assembly market. Since 2021 he is leading the Engineering Department at Ametec Coining where he is involved with new alloy development programs for soldering and brazing alloys and engineered materials programs for advanced electronic packaging.

Professor Dr.rer.nat. Marius Enachescu with international recognition, being among the world pioneers in designing and building STM-AFM systems as basic instruments for investigations at atomic and nanoscale (at Technical University of Munich, Germany, 1990-1995). After a long period of research in world leading laboratories in the field of nanoscience and nanotechnologies (1997-2009 at Lawrence Berkley laboratory and CEO&CTO-Marena Systems Corporation, Hayward-Silicon Valley, USA) he returned in his country of origin, Romania, bringing with him an invaluable expertise in exploiting quantum effects and nano-scale phenomena in order to design and develop new fundamental concepts and building innovative devices for various applications, including nanoelectronics, nanofabrication, nanotechnologies, nanotribology, nanomechanics and nanooptics fields. He is currently Professor at University POLITEHNICA of Bucharest and Vice-Rector and Director of Council for Doctoral Studies at the University of Pitesti. Professor Enachescu is the author/co-author of 12 International patents: USA-5, Taiwan-2, Europe-4, China-1; 9 books/chapters, all in international publishing houses; over 100 articles published in ISI journals; h-index: 22; over 25 invited lectures to international conferences and universities; author/co-author of ~250 other invited and contributed presentations at various international conferences/congresses. He led over 38 international projects in USA and Europe and has been awarded with gold medals, national and international prizes for his scientific achievements. He is also the founder and Head of the Center for Surface Science and NanoTechnology (CSSNT) at UPB.

Dr. Goran Mišković (Senior scientist and Project Manager) IEEE Senior member and nanopackaging  TC member. He received his Ph.D. with honors in 2016 from Vienna University of Technology (TU Wien), where he dealt with metal oxide-based gas sensors , with the accent on detection of NOx gasses. From 2012 till 2016, he worked as a lecturer and project assistant on two FP7 projects as well as on several bilateral and industrial projects at TU Wien, where he dealt sensors and actuators fabricated with multilayer Low Temperature Co-Fired Ceramic (LTCC) technology. After completion of the doctoral studies, he has switched to the industry and joined TDK Electronics, where was working in the corporate R&D - innovative topic group. His main activities and responsibilities were evaluation and assessment of new technologies, concepts and ideas. Since 2020, he has joined Silicon Austria Labs, Austria’s reputable R&D and competence center, and since July 2021 he became certified IPMA Project Manager. He is a member of the Sensor System research division and his main research interests are in field of heterogeneous integration & packaging, sensors & actuators, additive manufacturing, material science and technology, MEMS devices, microsystem technologies, flexible and wearable electronics and hybrid systems.

Michiel de Monchy is the European applications engineer for Powerelectronics within MacdermidAlpha Assembly Solutions (The Netherlands). He has been involved in powerelectronics for over 22 years and has been involved in sintering for over 10 years.

Klaus-Jürgen Wolter, Technische Universität Dresden, Germany
Prof. Klaus Wolter’s research interests have embraced many aspects of microelectronics packaging, including substrate technologies, assembly technologies, photonic packaging, MEMS, joining technologies, reliability of electronic packages, and non-destructive test methods. He is well known as co-author of six textbooks, co-editor of three book series with a total of 39 books, author and co-author of more than 200 papers. He is a senior member of IEEE-EPS. Prof. Wolter was the Director of the Electronic Packaging Lab at TU Dresden from 2003 to 2014. Currently he is a senior professor at TU Dresden.

Paul Svasta, University Politehnica of Bucharest, Romania
Professor Paul Svasta is one of the most reputable personalities in the field of electronic microsystems technology. He has dedicated his whole professional activity to the topic of electronic packaging.  He joined UPB, the Department of Electronics Technology and Reliability in 1968, and is the Head of Center for technological Electronics and Interconnection Techniques. Professor Svasta represent a driving force in promoting electronics packaging in many universities in Romania (within, ISSE, SIITME, TIE), and the collaboration between industry and academia, he is active within IEEE-EPS, IMAPS, APTE.

Martin K. Anselm holds an undergraduate degree in Physics, a Masters in Mechanical Engineering and a Ph.D. in Materials Science & Engineering.  Dr. Anselm's Industrial experience includes twelve years of electronics failure analysis and root cause analysis. He also managed the Universal Instruments AREA Consortium which conducted research in assembly materials, process and reliability of electronic packaging. Dr. Anselm serves as the President of the SMTA organization.  Since 2014 Dr. Anselm has been teaching electronics manufacturing at Rochester Institute of Technology and is the director of the MMET department’s Manufacturing and Mechanical Systems Integrations (MMSI) graduate program.
Title of the Presentation:  Educating the next generation of Engineers in Electronics Manufacturing and Reliability
Short content of the presentation: A short introduction of the topics covered in teaching mechanical and electrical engineering students in the materials and processes in electronics manufacturing.  Future designers and manufacturing engineers need to understand electronics manufacturing even if they may not have the process in their own factories.

Leon Brai is the group manager at Robert Bosch Romania, being responsible for hardware integration in ADAS systems. He obtained his Ph. D. degree in mechatronics and has a strong background with industrial mobile robots where he activated prior to Bosch. He is currently managing multiple teams that are developing electronic solutions for ADAS industry and he is responsible for different educational programs at Bosch representing the company in collaboration with the universities.
Title of the Presentation: Interdisciplinarity in Hardware Integration – use case in multimarket business.
Short content of the presentation: An overview will be presented regarding the development process of an electrified baby stroller where multiple competences had to be integrated into a completely new design. Starting from the initial requirements to the final release for manufacturing, different experiences will be presented. A more in-depth example will be exposed regarding the thermal management of the system and how mechanics, electronics, reliability, and software are all coming together to offer a very close to reality simulation.

Beth Keser, Ph.D. & IEEE Fellow, is a recognized global leader in the semiconductor packaging industry with over 24 years of experience.  She received her B.S. degree in Materials Science and Engineering from Cornell University and her Ph.D. from the University of Illinois at Urbana-Champaign.  Beth’s excellence in developing revolutionary electronic packages for semiconductor devices has resulted in 41 U.S. patents and patents pending and over 50 publications in the semiconductor industry.  Based in San Diego, Beth leads Intel’s Packaging & Systems Technology department.  Currently, Beth is the President of IMAPS.
Title of the Presentation:  Intel Workforce needs in Europe
Short content of the presentation: In March 2022, Intel announced plans to invest an initial 17 billion euros into a leading-edge semiconductor fab mega-site in Germany, to establish a new research and development (R&D) and design hub in France, and to expand capacities in R&D, manufacturing and foundry services in Ireland, Italy, Poland and Spain. This is the first phase of Intel’s plans to invest as much as 80 billion euros in the European Union over the next decade along the entire semiconductor value chain—from R&D to manufacturing and advanced packaging. With this landmark investment, Intel will bring its most advanced technology to the continent, helping the EU create a next-generation European chip ecosystem and addressing the global need for a more balanced and resilient supply chain. This presentation will discuss the skillsets Intel will require in Europe to support this investment.

Cătălin Negrea, obtained a Ph. D. degree from Politehnica University of Bucharest in 2013, with a thesis focused on multidisciplinary modeling and electro-thermal simulation of semiconductor devices. Catalin has organized several workshops on the topic on high-speed design and is a strong advocate of the concept “simulation-driven design flow”. He has provided several talks at conferences and engineering simulation user meetings on the importance of virtual prototyping and concurrent engineering. In 2013 he was nominated as a company level expert in the field of signal and power integrity. In 2014 He founded DarkNote Engineering as an R&D service provider focused on high-speed design and thermal management virtual prototyping activities as well as compliance measurements and design validation. From 2015 he is also coordinating TIEplus, a student contest focused on the signal integrity simulation of high-speed interfaces. Catalin is the author of more than 20 scientific papers in the fields of thermal management and signal integrity.
Title of the Presentation: Introduction to the extracurricular contests: TIE - “Techniques of Interconnection in Electronics”, The step towards interconnect simulation technology
Short content of the presentation: An introduction will be made that describes a series of electronics packaging know how scale-up events, TIE, TIEplus and TIE M. The organizing structure and the topics are similar with the industry requirements it is worthy to understand the basics of a 3-decade environment. The students who participated proved there is a high return on invest (ROI) in specialists and experts for the IEEE EPS community.

Mark D. Poliks is a SUNY Distinguished Professor in Materials Science and Engineering and Systems Science and Industrial Engineering at Binghamton University.  He is the director of the Center of Advanced Microelectronics Manufacturing a New York State Center of Advanced Technology and the New York Node of NextFlex Manufacturing USA, a federally funded manufacturing innovation institute.  Poliks was general chair of the 69th ECTC, and currently serves as director of student programs for IEEE EPS.  Poliks received his Ph.D. in Materials Science and Engineering from The University of Connecticut and was a senior technical manager and director at the IBM Corporation before transitioning to a full-time academic appointment at Binghamton.
Title of the Presentation:  Education and Training in Electronics Packaging
Short content of the presentation:  Training the next generation of scientists and engineers to work in the field of electronics packaging involves a highly interdisciplinary program of study and research involving design, materials and processing, fabrication, test, and reliability.  This presentation will describe courses and programs at Binghamton University as well as those that are part of NextFlex’s workforce development programs.

Martin Schneider-Ramelwo, born in 1964 in Thuine (Emsland) in the north-west of Germany near the Dutch border. Professor Martin Schneider-Ramelow has established himself as one of Germany’s leading microelectronics researchers and teachers, serving as Acting Director of the Fraunhofer Institute for Reliability and Microintegration IZM and Professor of “Materials in Hetero System Integration” at the Technical University of Berlin since 2017. Beginning his academic career in several research assistant roles in metallurgy and materials science at the TU Berlin, Professor Schneider-Ramelow completed his engineering doctorate with honours at the University’s then Institute of Materials Technologies in 1998 and joined Fraunhofer IZM in August that year. His research and development work, especially in the field of metallic interconnects and their reliability, is one pillar of Professor Schneider-Ramelow’s standing in his field. The other is his continued commitment to scientific education, initially as scientific staff and lecture at the TU Berlin (from 1992-1997 in the field of material science for students of Mechanical Engineering), as head of the “Materials Technology” mentoring course of the TU Berlin’s International Office (from 1995 to 2003), as lecturer again in the field of material science but for students of Electrical Engineering and, from 2014, as Visiting Professor and later Full Professor at the University. The scientific community’s high regard for Prof. Schneider-Ramelow is reflected in his 2013 appointment as Senior Member of the IEEE and his IMAPS fellowship and Fellow of the Society Award in 2016.
Title of the Presentation: Advanced Packaging Institutions and Activities in Germany
Short content of the presentation: Prof. Martin Schneider-Ramelow will introduce German Universities as well as Fraunhofer Institutes acting in the field of advanced microelectronic packaging. He also will highlight some activities in this content with great impact to the European Industry and give a short outlook to ongoing research activities.

Jeffrey C. Suhling received his Ph.D. degree in Engineering Mechanics from the University of Wisconsin.  He then joined the Department of Mechanical Engineering at Auburn University, where he currently holds the rank of Quina Distinguished Professor and Department Chair.  From 2002-2008, he served as Center Director for the NSF Center for Advance Vehicle Electronics.  His research interests include applications of solid mechanics and materials science to electronics packaging.  Dr. Suhling currently serves as Vice President for Education for the IEEE Electronics Packaging Society, and was the General Chair of the 2019 IEEE ITherm Conference.
Title of the Presentation: University Level Packaging Courses in the USA and IEEE EPS Student Competitions
Short content of the presentation: An introduction will be made to interdisciplinary courses offered at several universities in the USA that cover various aspects of electronics packaging including mechanics and reliability, thermal management, materials science, electrical design, and assembly and manufacturing.  In addition, the opportunities in the IEEE Electronics Packaging Society that are available to university students to present their research and compete will be reviewed.

Attila Bonyár is an associate professor and head of the Nanotechnology laboratory at the Department of Electronics Technology, Faculty of Electronics Engineering and Informatics, Budapest University of Technology and Economics. He has two M.Sc. degrees in electrical engineering (2009) and biomedical engineering (2011), a Ph.D. (2014), and habilitation (2021) in electrical engineering. His current research activities are focused on the development of optical biosensor technologies utilizing plasmonics, low-dimensional nanomaterials, nanocomposites and nanometrology. He is the chair of the IEEE NTC/EPS Nanopackaging/Nanotechnology Technical Committee (since 2022, co-chair since 2020) and actively serves in many other international committees in elected positions. He is a Steering Committee member for two regional IEEE conferences (IEEE-SIITME, International Symposium for Design and Technology in Electronics Packaging, since 2014 and IEEE-ISSE, International Spring Seminar on Electronics Technology, since 2017). Since 2019 he is the chair of the IEEE Hungary&Romania EPS&NTC Joint Chapter. He also serves IEEE NTC as a regional chapter coordinator in R8.