• 2006, Dresden, Fireworks artist during welcome reception
  • 2006, Dresden, Keynote presentation
  • 2008, Greenwich, University Campus
  • 2016, Grenoble, Networking during break
  • 2014, Helsinki, Audience
  • 2016, Grenoble, Audience
  • 2016, Grenoble, Poster Presentation
  • 2008, Greenwich, Exhibition
  • 2008, Greenwich, Conference attendees
  • 2010, Berlin, Keynote
  • 2010, Berlin, Networking
  • 2014, Helsinki, Finlandia Hall
  • 2018, Dresden, PDC
  • 2018, Dresden, Conference dinner
  • 2020, Vestfold, Virtual HIR workshop panelists
  • 2020, Vestfold, Virtual conference chairing
  • 2022, Sibiu, Exhibition
  • 2022, Sibiu, Plenary Session
  • 2022, Sibiu, Gala Dinner

ESTC 2022 Technical Program

Visit the Poster Gallery with short poster video pitches!

TECHNICAL PROGRAM

Below is the up-to-date schedule for the technical program of ESTC 2022. Click on the arrows at the end of the day headline to show or hide details for that conference day.
You may highlight the presentations you are especially interested in by simply clicking on that particular entry in the schedule. Your selection is stored in your web browser, so if you come back later on (using the same device and browser, of course), your selection will still be marked.
Note: All times are given in Sibiu local time, which is during the conference Eastern European Summer Time EEST!
Tuesday, 13 September 2022
08:30 - Sponsored Sessions 1 & 4
10:20 - Coffee break
10:30 - Sponsored Sessions 3 & 2
12:00 - Lunch break
12:30 - Opening Session
13:00 - Opening Keynote
13:35 - Keynote 1
14:10 - Technical Sessions 1-5
Session: Advanced Packaging 1
Chaired by: Matti Mäntysalo, Tampere University
                  Tanja Braun, Fraunhofer IZM
Room: ATLASS-A
Session: Materials for Interconnects and Packaging 1
Chaired by: Knut Aasmundtveit, University of South-Eastern Norway
                  Jeff Suhling, Auburn University
Room: HERA
Session: Reliability of Electronic Devices and Systems 1
Chaired by: Pradeep Lall, Auburn University
                  Kirsten Weide-Zaage, Uni Hannover
Room: ALFA
Session: Design Tools and Modeling
Chaired by: Thomas Zerna, TU Dresden
                  Cosmin Moisa, Continental Automotive Romania
Room: BETTA
15:55 - Coffee break
16:10 - Technical Sessions 6-10
Session: Advanced Packaging 2
Chaired by: Rolf Aschenbrenner, Fraunhofer IZM
                  Klaus Pressel, Infineon
Room: ATLASS-A
Session: Optoelectronic Systems Packaging 1
Chaired by: Krzysztof Nieweglowski, TU Dresden
                  Ovidiu Pop, University of Cluj-Napoca
Room: HERA
Session: Assembly and Manufacturing Technologies 1
Chaired by: Daniel Wright, SINTEF
                  Bogdan Mihailescu, Politehnica University of Bucharest
Room: ALFA
Session: RF, mm-wave and THz Systems Packaging
Chaired by: Maurizio Cirillo, Rheinmetall
                  Andreas Ostmann, Fraunhofer IZM
Room: BETTA
17:55 - Keynote 2
18:20 - Industrial pitch
19:20 - Poster Evaluation Session
Session: Poster Exhibition & Evaluation
Room: ATLASS-B
Wednesday, 14 September 2022
08:30 - Keynotes 3-x
09:05 - Technical Sessions 11-15
Session: Materials for Interconnects and Packaging 2
Chaired by: Mihai Branzei Polytechnic, University of Bucharest
                  Thomas Löher, Fraunhofer IZM
Room: ATLASS-A
Session: Flexible, Printed and Hybrid Electronics
Chaired by: Nenad Marjanovic, CSEM
                  Detlef Bonfert, Fraunhofer EMFT
Room: HERA
Session: Advanced Technologies for Emerging Systems
Chaired by: Martin Schneider-Ramelow, Fraunhofer IZM
                  Martin Oppermann, TU Dresden
Room: ALFA
Session: Power Electronics Packaging 1
Chaired by: Niko Pavlicek, Hitachi Energy Research
                  Aurelian Kotlar, Eberspächer
Room: BETTA
10:50 - Coffee break
11:20 - Workshops 1-3
Session: Workshop 3
Room: ATLASS-A
Session: Workshop 2
Room: HERA
Session: Workshop 1
Room: ALFA
12:50 - Lunch break
13:55 - Keynote 5
14:30 - Technical Sessions 16-20
Session: Advanced Packaging 3
Chaired by: Beth Keser, INTEL
                  Steffen Kröhnert, Espat-Consulting
Room: ATLASS-A
Session: Assembly and Manufacturing Technologies 2
Chaired by: Erik Jung, Fraunhofer IZM
                  Rajmand Jano, University of Cluj-Napoca
Room: HERA
Session: Reliability of Electronic Devices and Systems 2
Chaired by: Karsten Meier, TU Dresden
                  Susan Zhao, Signify
Room: ALFA
Session: Biomedical Application Packaging
Chaired by: Attila Bonyar, BUTE
                  Monica Ciolacu, University of Passau
Room: BETTA
16:15 - Keynote 4
16:50 - Industrial pitch
Thursday, 15 September 2022
09:00 - Workshop 4 et al.
Session: Workshop 4
Room: ATLASS-A
Session: Special Workshop
Room: HERA
10:30 - Coffee break
10:50 - Technical Sessions 21-25
Session: Power Electronics Packaging 2
Chaired by: Tina Thomas, Fraunhofer IZM
                  Dorin Petreus, University of Cluj-Napoca
Room: ATLASS-A
Session: Materials for Interconnects and Packaging 3
Chaired by: Toni Mattila, Business Finnland
                  Kitty Pearsall, Boss Precision, Inc
Room: HERA
Session: Reliability of Electronic Devices and Systems 3
Chaired by: Matthias Petzold, Fraunhofer IMWS
                  Piotr Mackowiak, Fraunhofer IZM
Room: ALFA
Session: Optoelectronic Systems Packaging 2
Chaired by: Marian Vladescu University Politehnica of Bucharest
                  Gabriel Chindris, University of Cluj-Napoca
Room: BETTA
Session: Global Education for Electronics
Chaired by: Paul Svasta, Politehnica University of Bucharest
                  Kristin Imenes, University of South-Eastern Norway
Room: GAMMA
12:40 - Lunch break
13:40 - Workshop 5
15:40 - Coffee break
15:55 - Workshop 6
Session: Workshop 6
Room: ATLASS-A
18:00 - Closing Session
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Supporting Organizations
ESTC 2022 Local Organizers
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