Technical Program Committee

The Technical Program Committee plays an important role in ensuring the quality of ESTC. Reviewing the submitted abstracts and papers and finally compiling an interesting and high-class technical program is only possible based on expert driven subcommittees.

The Technical Program Chair, coordinating the work of the subcommittees, changes from one ESTC to the next, while most of the subcommittee members already support ESTC for a long time. There is one subcommittee for each of the conference topics and one additional subcommittee responsible for the poster presentations. 

Technical Program Chair for ESTC 2022

Tanja Braun, Fraunhofer IZM Berlin, Germany

Advanced Packaging Subcommittee

• Chair: Rolf Aschenbrenner, Fraunhofer IZM Berlin, Germany
• Co-Chair: Klaus Pressel, Infineon Technologies AG, Germany
• Members:
  Eric Beyne, IMEC, Belgium
  Björn Böhme, Global Foundries Dresden, Germany
  Marin Gheorghe, NANOM-MEMS, Romania
  Beth Keser, Intel Germany
  Steffen Kröhnert, ESPAT Consulting, Germany
  Franck Murray, Murata, France
  Ranjan Rajoo, Global Foundries, Singapore
  Hannes Stahr, AT&S, Austria
  Jan Vardaman, TechSearch, USA
  Tiwei Wei, Stanford University, USA
  Seungwook (Stewart) Yoon, Samsung, South Korea
  Christophe Zinck, ASE, France

Materials for Interconnects and Packaging Subcommittee

• Chair: Johan Liu, Chalmers University of Technology, Göteborg, Sweden
• Co-Chair: Glenn Ross, Aalto University, Finland
• Members:
  Ana Barar, University Politechnica Bucharest, Romania
  Mihai Branzei, University Politechnica Bucharest, Romania
  Liqiang Cao, Institute of Microelectronics, Chinese Academy of Sciences, China
  Paul Conway, University of Loughborough
  Brad Factor, ASE Group, France
  Jan Felba, University of Wroclaw, Poland
  Yifeng Fu, Chalmers University Göteborg, Sweden
  Mihai Gabor, TU Cluj-Napoca; Romania
  Helge Kristiansen, Conpart, Norway
  Andreas Larsson, Tegma, Norway
  Samjid H. Mannan, King's College London, UK
  James E. Morris, Portland State University, USA
  Hiroshi Nishikawa, Osaka University, Japan

Optoelectronic Systems Packaging Subcommittee

• Chair:  Giovanni Delrosso, VTT, Finland
• Co-Chair: Henning Schröder, Fraunhofer IZM, Germany
• Members:
  Stéphane Bernabé, CEA LETI, France
  Karlheinz Bock, TU Dresden, Germany
  Ulrich Fischer-Hirchert, Univ. of Appl. Sci., Germany
  Krzysztof Nieweglowski, TU Dresden, Germany
  András Poppe, Budapest University of Technology and Economics, Hungary
  Mark Shaw, ST Agrate, Italy
  Maria Chiara Ubaldi, Fondazione CIFE, Italy
  Marian Vladescu, University Politechnica Bucharest, Romania

Assembly and Manufacturing Technologies Subcommittee

• Chair: Erik Jung, Fraunhofer IZM, Germany
• Co-Chair: David Whalley, University of Loughborough, UK
• Members:
  Knut E. Aasmundtveit, Vestfold Univ. College, Norway
  Gabriel Chindris, Technical University of Cluj Napoca, Romania
  Michel Garnier, STMicroelectronics, France
  Attila Géczy, Budapest University of Technology and Economics, Hungary
  David Henry, CEA LETI Grenoble, France
  Hoang-Vu Nguyen, University of South-Eastern Norway, Norway
  Machiel Peters, Philips B.V., The Netherlands

Design Tools and Modeling Subcommittee

• Chair: Chris Bailey, University of Greenwich, UK
• Co-Chair: Balasz Illes, Budapest University of Technology and Economics, Hungary
• Members:
  Laurent Bechou, ims Bordeaux, France
  Boris Evstatie, University of Ruse Angel Kanchev, Bulgaria
  Bernard Flechet, IMEP, France  
  Catalin Negrea, Continental Automotive, Romania
  Michiel van Soestbergen, NXP, The Netherlands
  Ovidiu A. Pop, TU Cluj-Napoca, Romania
  Anna Stoynova, Technical University of Sofia, Bulgaria
  Stoyan Stoyanov, University of Greenwich, UK

Power Electronics System Packaging Subcommittee

• Chair: Thomas Harder, ECPE European Center for Power Electronics, Germany
• Co-Chair: Jürgen Schuderer, Hitachi Energy, Switzerland
• Members:
  Cyril Buttay, Université de Lyon, Laboratoire Ampère, France
  Alberto Castellazzi, Kyoto University of Advanced Science, Japan
  Kay Essig, ASE Group, Germany
  Andreas Fischer, Bosch, Germany
  Aurelian Kotlar, Eberspächer Cluj-Napoca, Romania
  Dan Lascu, University Politehnica of Timisoara, Romania
  Frank Osterwald, Danfoss Silicon Power, Germany
  Dorin Petreus, TU Cluj-Napoca, Romania
  Jelena Popovic-Gerber, University of Twente, The Netherlands
  Christian Schellenberg, Siemens, Germany
  Tina Thomas, Fraunhofer IZM, Germany

Advanced Technologies for Emerging Systems Subcommittee

• Chair: Martin Schneider-Ramelow, Fraunhofer IZM, Germany
• Co-Chair: Martin Oppermann, TU Dresden, Germany
• Members:
  Attila Bonyár, Budapest University of Technology and Economics, Hungary
  Perceval Coudrain, CEA LETI, France
  Ferenc Ender, Budapest University of Technology and Economics, Hungary
  Aurel Gontean, University Politehnica of Timisoara, Romania
  Alexander Klemm, Bosch, Germany
  Changqing Liu, Loughborough University, UK
  Toni Mattila, Business Finland, Finland
  Cosmin Moisa, Continental Automotive Timisoara, Romania
  Klaus-Jürgen Wolter, TU Dresden, Germany
  Thomas Zerna, TU Dresden, Germany

Reliability of Electronic Devices and Systems Subcommittee

• Chair: Matthias Petzold, Fraunhofer IWM, Germany
• Co-Chair: Kirsten Weide-Zaage, Leibniz University Hannover, Germany
• Members:
  Florin Berinde, Vitesco Technology Timisoara, Romania
  Derek Braden, Aptiv, UK
  Joke de Messemaeker, imec, Belgium
  Hélène Frémont, IMS Bordeaux, France
  Laura Frisk, Trelic Ltd., Finland
  Dave Harvey, Liverpool John Moores University, UK
  Matthias Heimann, Siemens, Germany
  Zhiheng Huang, Sun Yat-sen University, China (PRC)
  Bálint Medgyes, Budapest University of Technology and Economics, Hungary
  Karsten Meier, TU Dresden, Germany
  Marta Rencz, Budapest University of Technology and Economics, Hungary
  Romuald Roucou, NXP,  The Netherlands
  Vesa Vuorinen, Aalto University, Finland
  Olaf Wittler, Fraunhofer IZM, Germany

Flexible, Printed and Hybrid Electronics Subcommittee

• Chair:  Matti Mäntysalo, Tampere University, Finland
• Co-Chair: Nenad Marjanovic, CSEM, Switzerland
• Members:
  Nicolas Bernardin, iSorg, France
  David Bird, National Centre for Printable Electronics, UK
  Karlheinz Bock, TU Dresden, Germany
  Detlef Bonfert, Fraunhofer EMFT Munich, Germany
  Zheng Cui, Chinese Academy of Sciences, China
  Claudia Delgado, Eurecat, Spain
  Jukka Hast, VTT, Finland
  Ciprian Ionescu, University Politechnica Bucharest, Romania
  Jean Charles Souriau, CEA LETI, France
  Ashok Sridhar, TNO, Netherlands
  Johanna Virkki, Tampere University, Finland